The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1986
Filed:
Feb. 21, 1984
Hirotoshi Ikeya, Yokosuka, JP;
Shuichi Suzuki, Yokohama, JP;
Takayuki Oguni, Yokohama, JP;
Kazutaka Matsumoto, Yokohama, JP;
Akiko Hatanaka, Yokohama, JP;
Tokyo Shibaura Denki Kabushiki Kaisha, Kawasaki, JP;
Abstract
There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic tertiary phosphine compound as curing accelerator. The resin encapsulation type semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.