The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1986
Filed:
Oct. 14, 1983
James Reid, Santa Ynez, CA (US);
Gary E Roberts, Santa Barbara, CA (US);
Applied Magnetics Corporation, Goleta, CA (US);
Abstract
A method of manufacturing a transducing sub-assembly for a magnetic head assembly comprising the steps of affixing a transducer onto a substrate wherein the transducing element is located on one side thereof and leads extending from the transducing element are located on a different side thereof and wherein the substrate is formed of a material which is highly resistant to being abraded by a recording medium being transported thereacross and wherein the transducer is affixed to the support surface with the transducing element located adjacent the medium contacting surface and with the leads extending along the supporting surface away from the medium contacting surface; bonding a spacer to the substrate and transducer wherein the substrate and spacer are formed of a material which is highly resistant to being abraded by a recording medium and has a medium contacting surface of a preselected width and spaced sidewalls extending substantially perpendicular therefrom a distance equal to the length of the transducing element; bonding an electrical circuit means to the substrate and transducer wherein the electrical circuit means terminates in an edge having a width which does not exceed the preselected width and wherein the exposed conductors are positioned in electrical contact with the leads of the transducer and in opposed, spaced alignment from the spacer and applying a clamping force to the transducing subassembly during the bonding steps is shown. A product formed by using the process is also shown.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile