Method and unit for inspecting printed wiring boards

Abstract

A method for inspecting printed wiring boards which comprises superposing, on a printed wiring board to be inspected, a pressure-sensitive, electroconductive, elastic sheet, any portions of which become electroconductive in the direction of thickness of the elastic sheet when the portions have been pressed in the same direction, pressing the elastic sheet at portions corresponding to the electroconductive portions of said board by the use of inspecting electrodes, thereby electrically connecting the corresponding inspecting electrodes to the intended electroconductive portions of the printed wiring board. In said method, there is preferably used an inspecting unit which comprises the above-mentioned elastic sheet and an insulating, inspecting-electrode-holding plate provided so as to face the other side of said elastic sheet at a space, said inspecting electrode-holding plate holding a group of inspecting electrodes projecting from the plate surface into the space, said group of inspecting electrodes being arranged so as to correspond to an arrangement pattern of electroconductive portions of the printed wiring board to be inspected, and the inspecting electrode-holding plate being provided so that it can be relatively pressed in the direction of approaching the printed wiring board.