The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 1986
Filed:
Nov. 08, 1982
Martin A Kalfus, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A means and method is provided for forming power devices using multiple semiconductor die. Typically, several semiconductor die or die assemblies with contact disks are mounted on a base plate in a spaced apart relationship. A compliant connector member which supports a massive power terminal, bridges between the die to which it is bonded via crushable contact dimples, to form an assembly. The assembly deforms during insertion into the mold to accommodate thickness variations and seat the outward faces of the terminal and base plate against the matching mold faces. When the plastic molding compound is injected into the mold there is a net outward force which seals the outward terminal, base and corresponding mold faces together to prevent encroachment of the plastic therebetween.