The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 1986
Filed:
Nov. 28, 1984
Applicant:
Inventor:
Eugene Phillips, Diamond Bar, CA (US);
Assignee:
General Dynamics, Pomona Division, Pomona, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 40 ; 427 98 ; 427123 ; 427125 ; 427305 ; 427328 ; 4274431 ; 4274432 ;
Abstract
A method for electroless overplating of a conductive metal on printed wiring circuitry components mounted upon a plastic substrate which eliminates deposit metal overgrowth upon the plastic substrate and plastic bonding materials. The substrate and printed wiring are treated by exposure to a tetrafluoromethane plasma environment to chemically passivate, or neutralize, the plastic or adhesive substrate surface areas prior to electroless plating of the printed circuitry elements, thus preventing the establishment of catalyzing ions on the plastic or adhesive surfaces and subsequent lay down of the deposited metal thereon.