The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 1986
Filed:
Oct. 26, 1984
Roxy N Fan, E. Brunswick, NJ (US);
E. I. Du Pont de Nemours and Company, Wilmington, DE (US);
Abstract
Process for preparing multilayer printed circuits comprising laminating simultaneously or sequentially to a substrate bearing a circuit pattern two photopolymerizable layers, the lower layer formulated for bulk response as defined and the upper layer formulated for surface response as defined; exposing the laminate to actinic radiation through a circuit image related to the circuit pattern on the substrate; embedding finely divided metal, e.g., copper, to the tacky image areas; exposing the toned laminate to actinic radiation through an image of at least one overlying segment of the conductive circuit pattern; removing unexposed photopolymer from the two layers to form vias; embedding finely divided metal, e.g., copper, or catalyst to the side walls of the vias; optionally, curing the image by exposing to actinic radiation and/or by heating; plating to form an interconnected electrically conductive circuit. Additional circuit layers can be added by repeating the process using the newly plated circuit pattern as a substrate.