The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1986
Filed:
Aug. 20, 1984
Akinori Minami, Moriyama, JP;
Katsuyoshi Yamauchi, Moriyama, JP;
Japan Vilene Co. Ltd., Tokyo, JP;
Abstract
A material with high thermal conductivity for insulating electronic parts is formed by exposure to a compressive shearing force of a compound containing 50 to 95% by volume heat conductive, inorganic powder and 5 to 50% by volume bonding agent. The bonding agent contains at least 0.2 to 30% by volume polytetrafluoroethylene (PTFE), preferably 1.0 to 20%, and synthetic rubber, where the volume ratio of rubber is 1/4 or more of the PTFE. The compressive shearing force fibrillates the PTFE and disperses the inorganic powder so that there is an even aggregation of heat conductive material. Other ingredients such as vulcanizing agents, vulcanizing accelerators, stabilizers, processing aids, flame retardents, coloring agents, and solvents may be added. The material may be reinforced with a woven or non-woven fabric or staple fibers.