The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 1985

Filed:

Dec. 14, 1983
Applicant:
Inventors:

Tadakatsu Nakajima, Ibaraki, JP;

Wataru Nakayama, Kashiwa, JP;

Takahiro Daikoku, Ibaraki, JP;

Heikichi Kuwahara, Ibaraki, JP;

Akira Yasukawa, Ibaraki, JP;

Katsuhiko Kasuya, Ibaraki, JP;

Kazuaki Yokoi, Ibaraki, JP;

Hideo Nakae, Tokyo, JP;

Hiromichi Yoshida, Hitachi, JP;

Assignees:

Hitachi, Ltd., Tokyo, JP;

Hitachi Cable Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F / ;
U.S. Cl.
CPC ...
165133 ; 2915 / ;
Abstract

In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.


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