The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 1985
Filed:
Jul. 12, 1984
Dean E Eastman, Ossining, NY (US);
Jerome M Eldridge, Los Gatos, CA (US);
Kurt E Petersen, San Jose, CA (US);
Graham Olive, San Jose, CA (US);
IBM Corporation, Yorktown Heights, NY (US);
Abstract
A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sink, in the form of a 'cooling chip', in intimate contact with the back surface of an integrated circuit chip (in a 'flip chip' configuration, the front, or circuit-implemented, surface, makes contact with a ceramic carrier or module); the cooling chip is provided with a plurality of spaced parallel grooves which extend along the one side or surface opposite the surface that is in bearing contact with the integrated circuit chip, whereby liquid coolant flows through the grooves so as to remove heat from the integrated circuit chip; further included in the system is a specially configured bellows for conducting the liquid coolant from a source to the heat-sink, and for removing the liquid coolant; a coolant distribution means, in the form of at least one glass plate or manifold, is provided with spaced passageways interconnecting the respective incoming and outgoing coolant flow paths of the bellows with the heat-sink.