The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 1985
Filed:
Dec. 31, 1984
Katsuzo Aihara, Hitachiohta, JP;
Naofumi Tada, Hitachi, JP;
Yasuo Suzuki, Takahagi, JP;
Joo Ishihara, Hitachi, JP;
Toshio Ogawa, Katsuta, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A method of producing a composite material of and Nb or V used for a superconductive wire comprises vacuum - melting two kinds of raw materials, 70 wt % Cu and 30 wt % Nb or V to form a melt; scattering the melt by a rotating disc to form a plurality of fine droplets each of which includes Cu and Nb or V at substantially the same compounding rate as the raw materials; and cooling rapidly the fine droplets by spraying an inert gas onto the scattering droplets thereby providing particulate bodies each of which dendrites of Nb or V are precipitated in Cu. The fine particles are compression - molded to form a molded product. The molded product is sintered to form an ingot in which the dendrites of Nb or V are dispersed homogeneously in the Cu base. The ingot is used for producing a superconductive wire, namely, it is subjected to cold rolling to reduce its sectional area, coating with Su or Ga, and diffusion heat-treating the wire to form Nb.sub.3 Sn or V.sub.3 Ga in the Cu base, whereby a superconductive wire is provided in which Nb.sub.3 Sn or V.sub.3 Ga are homogeneously dispersed in the Cu base.