The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 1985
Filed:
May. 17, 1982
Douglas H Strope, Apalachin, NY (US);
Thomas E Wray, Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A conductive film deposition rate monitoring method for measuring the real time deposition rate of a metallic deposition process particularly an electroless plating bath, including the steps of positioning an eddy current detector within a predetermined distance of a test surface where the deposition is to be deposited, and the step of monitoring the output of the detector. The apparatus comprises an eddy current sensor and a non-metallic housing for the sensor, having a non-conductive wall of predetermined thickness between the sensor and the surface of the wall distant from the sensor, the distant wall being immersed in the deposition environment, such as a plating bath, so that a deposit takes place on the distant surface, and measuring means connected to the output of the sensor for measuring the amplitude and rate of change of the output of the sensor.