The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 1985
Filed:
Jun. 14, 1984
Shunsaku Munakata, Kawagoe, JP;
Hitoshi Ukai, Niiza, JP;
Mitsuru Noguchi, Tsurugashima, JP;
Shinichi Sawai, Kunitachi, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Tokyo Seat Co., Ltd., Asaka, JP;
Abstract
In the air-pressure molding method according to the present invention, a laminated material is arranged, when in a heated and softened state, on the shaping face of a mold having an air reservoir, and the portion to be molded is hermetically sealed within a box-shaped top cover. Air under pressure higher than atmospheric pressure is then applied to the inside of the top cover so that the laminated material is developed and shaped to have a uniform thickness on the air-cushion layer which is established by the air pressure between the laminated material and the shaping face of the mold. Immediately after, the air in the cushion layer is forced to the air reservoir thereby bringing the laminated material into contact with the mold so that the surface of the skin may be reversely embossed or stitched.