Method and apparatus for touch-free lead bending

Abstract

Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and generally parallel to the top and bottom surface thereof. A support anvil is placed under the portion of the lead which is sealed in the semiconductor package, and a punch or bending member is disposed immediately adjacent the outside edge of the handle for performing the actual bending. A sheet of relatively thin metal is formed into a U-shaped channel and the bending member inserted therein before lowering so that as the bending member is lowered, no portion thereof touches the surface of the leads being bent. The sheet of thin metal buffers the bending operation and is interposed between the bottom and side of the bending member and the face of the leads for preventing scratching or damage thereto. At the end of the downward movement of the bending member, the row of leads is substantially nearly vertical and the anvil, sheet of metal and punch may be removed for the next successive dual-in-line package. For two row operation, both the anvil and the punch include die portions for bending the leads and the steel sheets are wound and unwound for protecting the leads being bent. A method of bending is also provided using a punch partially covered with a thin sheet of steel.