The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 1985
Filed:
May. 17, 1984
Applicant:
Inventors:
Manfred R Liehr, Hamburg, DE;
Wolfgang Nolting, Hamburg, DE;
Rolf U Kobs, Tornesch, DE;
Reiner U Orlowski, Quickborn, DE;
Assignee:
U.S. Philips Corporation, New York, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
22826312 ; 228194 ; 228234 ;
Abstract
The invention relates to a method for the force-coupled and vacuum-tight bonding of components of ceramic material together or to metallic components by means of thermocompression while using a soldering material in the form of an AlMgZn alloy provided between the components to be bonded prior to the thermocompression process. The soldering material used consists preferably of an aluminum-zinc-magnesium alloy having 95% by weight of Al, 4% by weight of Zn and 1% by weight of Mg.