The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 1985
Filed:
Sep. 28, 1982
Hisashi Watanabe, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A package for a semiconductor device including a sealing frame with first and second opposing sides, the second side having a projected edge portion comprising a flash or a burr produced by blanking presswork of the sealing frame. A package substrate is fixed to the first side of the sealing frame while a sealing cap is fixed to the second side of the sealing frame by seam welding. A semiconductor element is fixed to the package substrate. The sealing cap is seam welded to the sealing frame at the projected edge portion of the sealing frame and by doing so the contact resistance is increased so that reliable welding can be carried out and so that unnecessary heating of portions of the package other than the required welded portion can be prevented.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile