The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 1985
Filed:
Jul. 07, 1983
Applicant:
Inventors:
Hiromi Tosaki, Yokohama, JP;
Hirayoshi Tanei, Tokyo, JP;
Akira Ikegami, Yokohama, JP;
Nobuyuki Sugishita, Yokosuka, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C / ; H05K / ;
U.S. Cl.
CPC ...
174 685 ; 264 61 ; 361414 ; 427 96 ; 428137 ; 428901 ; 501 16 ; 501 54 ; 501 61 ; 501 62 ;
Abstract
A method for manufacturing the insulating layers of a glass multilayer wiring board from a mixture of (1) 30-90 wt. % of a borosilicate glass consisting of 55-75 wt. % of SiO.sub.2, 13-25 wt. % of B.sub.2 O.sub.3, 5-13 wt. % of Al.sub.2 O.sub.3, each 1-5 wt. % of PbO, MgO, and BaO, and each 1-2 wt. % of Na.sub.2 O and K.sub.2 O and (2) 70-10 wt. % of a silica glass, is provided.