Low profile test clip

Abstract

The present invention is an electrical clip-like connector that has a low profile and is capable of connecting the conductors of an electrical cable, for example, with the leads of an integrated circuit package or the like. Due to the low profile configuration of the invention, it may be used in situ in confined environments, and it also may be used for coupling relatively high speed signals without or with minimum antenna effect. Other features of the invention include a locating mechanism that facilitates applying the clip connector to an integrated circuit assuring proper alignment of the contacts and leads and a preferred contact/support arrangement to help assure good electrical connection with the integrated circuit leads and tolerance for size and location errors while avoiding overstress damage to the contacts. Still other features of the invention include the close packing of the contacts thereof preferably in dual-in-line opposed contact pair arrangement, for example without having to spread the conductors of a ribbon cable connected thereto, the ability to ground or otherwise to connect in common certain ones of such conductors and/or contacts, and a resilient pivot mechanism for the connector body portions, which also preferably relies on the characteristics of the electrical cable to which the body portions are connected (preferably by direct molding thereto) to stabilize and to strengthen the connection between such body portions. The invention also includes a handle to install and to remove the clip-like connector with respect to an integrated circuit package or the like.