The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 1985
Filed:
Mar. 25, 1983
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H05K / ;
U.S. Cl.
CPC ...
361387 ; 357 81 ; 361386 ; 228110 ;
Abstract
A device for cooling semiconductor elements is constituted by a plate for cooling semiconductor elements, the plate being made of aluminum or an aluminum alloy, and a semiconductor element-mounting sheet which is made of aluminum or an aluminum alloy, the sheet having on one surface thereof a metal layer to which solder can be applied as desired, and the other surface of the sheet being secured by ultrasonic welding to the plate in a recessed portion formed in the cooling plate by ultrasonic welding.