The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 1985
Filed:
Dec. 06, 1983
Applicant:
Inventors:
Assignee:
Tokyo Shibaura Denki Kabushiki Kaisha, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F / ; B44C / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
156630 ; 156634 ; 156656 ; 1566591 ; 156666 ; 156901 ; 156 89 ; 1563082 ;
Abstract
A method for manufacturing a semiconductor substrate. A copper sheet is placed on a surface of a ceramic plate and bonded thereto. A circuit pattern is then formed on the copper sheet by an etching process.
Quick Actions:
Mizunoya, Nobuyuki. (1985). Substrate for semiconductor modules and method of manufacture (U.S. Patent No. 4540462). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4540462
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile