The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 1985
Filed:
Jun. 12, 1984
Fujitsu Ltd., Kawasaki, JP;
Abstract
A semiconductor device comprising at least one heat sink joined to a plurality of IC packages mounted on a mother board. Plural individual heat sinks are joined to respectively corresponding IC packages each comprising a central shaft joined to and extending in substantially perpendicular relationship from a respective said package and plural, parallel spaced fins extending outwardly from and in perpendicular relationship to the shaft. A common heat sink for plural IC packages comprises a base board portion, a heat conducting shaft portion arranged perpendicular to the base board portion and a plurality of heat dissipating fins arranged perpendicular to said heat conducting shaft portion and in parallel, spaced relationship to each other, the common heat sink having one or more slits which are formed parallel to and extending through the heat conducting shaft from the base board portion to midway of the height of the heat conducting shaft and defining a plurality of sections of the base board portion, respectively, joined to the plurality of IC packages.