Capacitive device and method of packaging that device

Abstract

A capacitive device of the parallel plate type capacitor is disclosed with an improved system for packaging such devices. The devices disclosed have a plurality of strata of capacitive structures formed by alternating layers of dielectric material carrying metallic material thereon with successive layers of metallic material separated by dielectric material. Each layer of metallic material is electrically continuous substantially from the first end to a second end, a first group of the metallic layers is electrically continuous substantially from a first edge to a first continuity displaced from a second edge and a second group of metallic layers is electrically continuous substantially from a second edge to a second discontinuity displaced from the first edge; the first group alternates with the second group in the capacitive structure. The packaging system includes wrapping means, such as adhesive tape, for protecting the top, the first end, the bottom and the second end of the capacitive device; electrical leads connected to the exposed edges of the capacitive device; electrical leads connected to the exposed edges of the capacitive device by a plasma impact connection method; and impregnation of the device with a sealant such as wax. The invention provides substantially reduction in cost of manufacture, a significant reduction in volume occupied by the device, superior moisture resistance, improved dissapation factor of the capacitive device, and elimination of reflow of the electrical lead connections to the device during mounting of the device to an assembly such as a printed circuit board.