The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 1985

Filed:

Oct. 05, 1981
Applicant:
Inventor:

Earl P Carley, Upper Burrell, PA (US);

Assignee:

PPG Industries, Inc., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B32B / ; B65H / ; D04H / ;
U.S. Cl.
CPC ...
428109 ; 156161 ; 156162 ; 156171 ; 156173 ; 156176 ; 156177 ; 156178 ; 156179 ; 1563071 ; 156245 ; 264108 ; 264137 ; 264258 ; 428112 ; 428113 ; 428212 ; 428215 ; 428219 ; 428284 ; 428285 ; 428286 ; 428287 ; 428288 ; 428302 ; 428337 ; 428339 ; 428340 ; 428902 ;
Abstract

The method of the present invention produces a tape of high performance reinforcing fibers having improved alignment between the fibers and improved maintenance of that alignment in processing and molding applications. The method involves contacting one or more of the continuous high performance reinforcing fibers with a polymer impregnated mat. The polymer is compatible with any polymeric material used in the subsequent processing or molding applications. The contacting is performed with the high performance fibers under tension, and the tension is removed when the fibers are properly aligned into a tape in contact with the impregnated mat. The tape material can be used with various molding compounds such as sheet molding compounds and high reinforcement content molding compounds and thermoplastic molding materials wherein the molding compound is contacted with the tape product. The contacting can be performed during formation of the molding compound or the tape material can be applied to an already formed molding compound during compression molding.


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