The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 1985
Filed:
Apr. 12, 1984
Richard K Beltz, Hamburg, PA (US);
Donald M Large, Temple, PA (US);
AT&T Technologies, Inc., New York, NY (US);
Abstract
Components such as lids (9) and electronic chip carriers (10) are assembled by registering respective mating faces of each component. An array of assembly stations (75) are formed on an upwardly extending edge (67) of a base (66) having a special inclination. For example, a lid (9) is supported with its mating face upturned and a carrier (10) is supported with its mating face downturned upon the upturned face of the lid (9) on the base (66). The inclination causes the components to slide relative to each other and the base in a given direction within each station (75). A plate (92) overlies a plate (72), supported on and inclined with the base (66). Plate (72) has an opening (74) and plate (92) has an overlying opening (94) to each station (75). The openings (74) and (94) have respective reference edges for stopping sliding of, and thereby positioning an upturned lid (9) and a downturned carrier ( 10) thereupon with a desired registration. A shuttle mechanism (80) reciprocates plate (72) with the openings (74) to and from a magazine (78) to guidably deliver an inverted lid (9) into each station (75). Another magazine (90) is moved to and inclined with the base (66) and guidably delivers an inverted carrier (10) on top of each lid (9) in each station (75). Magazine (90) is moved away and a group clamp (125) is utilized to grasp a resulting array of assembled components for transfer to a subsequent operation.