The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 1985
Filed:
Jul. 30, 1982
Shinzo Anazawa, Tokyo, JP;
Hitoshi Yamada, Tokyo, JP;
Kuniharu Noda, Aichi, JP;
Yasuyuki Fujimoto, Aichi, JP;
Nippon Electric Co., Ltd., both of, JP;
Narumi China Corporation, both of, JP;
Abstract
An electronic part mounting construction, such as a transistor package or a substrate for a resin mold device, has a substrate for mounting an electronic part on a principal surface, at least one metallized layer deposited on the principal surface and soldered to the electronic part thereon, another metallized layer continuously extended from the at least one metallized layer in a direction perpendicular thereto, and an insulator layer deposited on the other metallized layer. The other metallized layer is provided on a side surface of a wall member or the substrate. The other metallized layer and the insulator layer may be formed by steps of forming a hole in an insulator sheet, depositing a metallized layer and an insulator layer successively on the surface of the hole, and leaving the metallized layer and the insulator layer at predetermined region(s) by punching the insulator sheet.