The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 1985
Filed:
Jul. 25, 1983
Applicant:
Inventors:
John C Carson, Corona del Mar, CA (US);
Stewart A Clark, Irvine, CA (US);
Assignee:
Irvine Sensors Corporation, Costa Mesa, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
2957 / ; 2957 / ; 29591 ; 357 75 ; 250553 ;
Abstract
A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
Quick Actions:
Carson, John. (1985). High-density electronic processing package-structure and fabrication (U.S. Patent No. 4525921). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4525921
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile