The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 1985

Filed:

Jul. 13, 1984
Applicant:
Inventors:

Yoshihiro Ebata, Kawanishi, JP;

Nobuyuki Tamari, Ikeda, JP;

Yasuo Toibana, Osaka, JP;

Ryozo Hayami, Takarazuka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ;
U.S. Cl.
CPC ...
427190 ; 427193 ; 427199 ; 427229 ; 427343 ; 427344 ; 427377 ; 427380 ; 427427 ;
Abstract

A process for metallizing the surface of a ceramic is provided. The surface of a ceramic is coated with a mixture of SiO.sub.2 and at least one copper compound selected from the group consisting of copper carbonate, copper sulfate, copper sulfide, copper oxide, and copper chloride. Thereafter, the film is heated at 900.degree. to 1300.degree. C. in an oxidizing atmosphere to form a baked layer on the surface of the ceramic. The ceramic having the baked layer formed thereon is subjected to a reduction treatment to form a copper-metallized layer on the surface of the ceramic.


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