The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 1985

Filed:

Sep. 27, 1982
Applicant:
Inventors:

Wolfgang Heinemann, Weissach, DE;

Rainer Noack, Bietigheim, DE;

Helmut Weyl, Schwieberdingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B / ;
U.S. Cl.
CPC ...
264 61 ; 29854 ; 29855 ; 29856 ; 264 62 ;
Abstract

To manufacture a vibration-resistant, shock-resistant electrical connection on a ceramic substrate (11) having an electrically conductive layer (12) applied to a surface (13, 19) thereof, a groove or channel-like depression (16, 20) is formed in the surface, preferably also including a through-bore (18), into which a conductor (17) is placed. The space between the conductor and the groove, the through-bore, if provided, and an extending groove at the other surface (19) of the substrate is filled with a sinterable mass (21), preferably a cermet, containing a metal which is compatible with the metal of the conductor wire (17), both for example containing platinum. As a starting material, the plate with the grooves therein is extrusion-pressed, pre-sintered at a low temperature to give it form stability, then the electrode (12) is applied, then the electrical conductor (17) and the cermet is applied and then the entire sub-assembly is fired to sintering temperature, e.g. about 1500.degree. C.; if desired, a further protective coating (22) of magnesium spinel may be plasma-sprayed on. Due to shrinkage of the ceramic components, the wire (17) will be securely held in position in the groove, and the cermet additionally forming an electrical connection between the wire and the substrate (11). For additional strain relief, the groove can be undulating (FIG. 3).


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