The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 1985
Filed:
Dec. 15, 1982
Applicant:
Inventors:
Hiromasa Chiba, Chibaken, JP;
Katsumi Kumahara, Ichiharashi, JP;
Takakiyo Harada, Ichiharashi, JP;
Takahiro Oka, Ichiharashi, JP;
Akihiro Sato, Ichiharashi, JP;
Assignee:
Chisso Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
526351 ; 526119 ; 526142 ; 525240 ;
Abstract
A polypropylene resin from which high-rigidity molded products can be produced even when no particular additive is added, is provided, which resin has a melt rate of 0.1 to 100, a density of 0.905 to 0.936, and a boiling n-heptane-insoluble part whose isotactic pentad ratio (P.sub.o) is 0.975 to 0.995, and whose pentad ratio (P.sub.2) having two different kinds of configurations of 0.002 to 0.000%, and preferably has a melting point of 165.degree. to 170.degree. C. as measured by differential scanning calorimetry.