The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 1985
Filed:
Jul. 11, 1984
Robert A Tremmel, Woodhaven, MI (US);
OMI International Corporation, Warren, MI (US);
Abstract
An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing agent present in an amount sufficient to complex an effective amount of the copper ions present, a bath soluble and compatible buffering agent present in an amount sufficient to stabilize the pH of the electrolyte, hydroxyl and/or hydrogen ions present in an amount to provide a pH of about 6 to about 10.5, and sulfamic acid and the bath soluble and compatible salts thereof present in an amount effective to increase the anode efficiency during the electrodeposition of copper from said electrolyte. The electrolyte can optionally, but preferably further contain ammonium ions in combination with the sulfamic acid constituent to further enhance the anode efficiency and a wetting agent present in an amount up to about 2 g/l. The process for electrodepositing copper employing the foregoing electrolyte is performed employing a combination of insoluble anodes and soluble copper anodes adjusted to attain replenishment of the copper ions consumed by the oxidation and dissolving of the copper anode.