The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 1985

Filed:

Jun. 23, 1983
Applicant:
Inventors:

John H Jones, Westfield, NJ (US);

Donald W Schoenleber, Princeton, NJ (US);

Assignee:

Beatrice Foods Co., Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D / ;
U.S. Cl.
CPC ...
229 72 ; 229 76 ; 283 51 ;
Abstract

A multi-compartment envelope for coupon nesting includes a rectangular blank having first, second and third spaced parallel scorelines defining first, second, third and fourth rectangular interconnected panels. A fold in the fourth panel provides a first panel portion and a second panel portion with the second panel portion being secured to the first panel portion and thereby providing a compartment. A slit is disposed in the compartment and divides the compartment into a first and a second compartment. A first and a second contoured slit are disposed, at least in part, in the first panel and provide a pair of wafer tabs. The first panel is in overlying relation with the second panel whereby the wafer tabs extend a substantial distance in a first direction away from the first panel. The fourth panel is folded along the third scoreline and overlies same while the third panel is then folded along the second scoreline whereby the fourth panel overlies the first panel and the third scoreline is proximate the first scoreline. The wafer tabs are folded so that a surface thereof engages the third panel and glue secures the first surface of the wafer tabs to the third panel.


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