Package

Abstract

Container package for transporting a plurality of silicon wafers for shipment as well as preventing contamination thereof. The wafer container package includes a wafer cassette having two sides, a configured end, and an H bar end including an upper and lower ramp support with the bar being reinforced by a partially cylindrical rod; a package bottom including four sides, an edge surrounding the sides, hook latches, four internal side dividing members and a flat bottom; and a package top including four sides, a lip to encompass the edge, configured independent opposing flexible grooved members, and recessed top surface for stacking where the cassette is positioned by internal side dividers in the package tops and bottoms for secure placement. The three components provide that the cassette mates between the package tops and bottoms, the wafers mate in the cassette and with the top opposing members, the package tops and bottoms mate between the trough, and the hook ends secure the package tops and bottoms together and also secure the cassette and wafers therein. The sides of the package are smooth, providing for a flush perimeter for taping. The recessed top surface provides for stacking of like packages. The smooth, rounded contour design of the package provides a package design for shrink wrapping. The package limits and prohibits wafer movement and eliminates wafer breakage.