Apparatus for injection compression molding

Abstract

An injection compression molding apparatus has a mold unit having a stationary die plate and a movable die plate movable toward and away from the stationary die plate with mold plates therebetween defining a mold cavity into which an injection nozzle is directed, a supporting plate, a main cylinder supported on the supporting plate and a main cylinder ram having the outer end connected to the movable die plate for moving the movable die plate between a position in which the mold is fully closed and a position in which the mold is open to permit discharge of a molded product, and a compression stroke setting device for setting the position of the movable die plate at a position spaced a distance away from the fully closed position corresponding to a desired compression stroke of the mold. The device includes an adjustment part positioned either between the stationary die plate and the movable die plate or between the movable die plate and the supporting plate which is movable laterally of the direction of movement of the movable die plate for permitting the movable die plate to move to the fully closed position or permitting the movable die plate to move to the open position of the mold.