The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1985
Filed:
Jun. 29, 1981
Yutaka Harada, Kodaira, JP;
Kunio Yamashita, Hachioji, JP;
Nobuo Kotera, Kokubunji, JP;
Hirotoshi Tanaka, Hachioji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A superconductive large-scale integrated circuit chip comprises a plurality of pads, a superconductive line which short-circuits respectively adjacent pairs of the pads, and an input buffer circuit. The input buffer circuit includes a Josephson junction which is either in a superconducting state or a finite voltage state in response to a magnetic field established by current that is supplied to the superconductive line by flowing in from one of the two pads and flowing out from the other pad. The input buffer circuit wave-shapes the externally supplied signal into an amplitude-controlled signal, and the latter signal is led by a superconductive line to a circuit within the chip which requires the signal. Even when the external signal current has become abnormally great due to noise, etc., any circuit situated halfway within the chip can be prevented from malfunctioning from the magnetic flux generated by the large current.