The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1985
Filed:
Jun. 05, 1984
Osao Kamada, Tokyo, JP;
Hitachi Cable Limited, Tokyo, JP;
Abstract
A process for producing cooper foil laminated plates using rolled copper foils made of oxygen-free copper is described. The major feature of the present process is that in laminating a rolled copper foil on an insulating substrate, the rolled copper foil is ground or abraded and immediately brought into contact with water or steam to form a hydrate layer on the surface thereof. This hydrate layer increases the adhesion strength of the rolled copper foil to the insulating substrate through an adhesive, producing a copper foil laminated plate having an adhesion strength sufficiently high for practical use. Thus these copper foil laminated plates are very suitable for use in wiring of electronic devices.