The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 1985

Filed:

Dec. 10, 1982
Applicant:
Inventors:

Yasuo Matsushita, Hitachi, JP;

Kousuke Nakamura, Hitachi, JP;

Mitsuru Ura, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 80 ; 357 67 ; 357 81 ; 357 74 ; 357 73 ;
Abstract

A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from a SiC-based substrate containing Be or a compound of Be with a thin SiO.sub.2 layer being capable of reacting with glass provided thereon and with a glass layer or a thin film circuit on the SiO.sub.2 layer.


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