The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 1985

Filed:

Apr. 06, 1984
Applicant:
Inventors:

Hideo Ohta, Nara, JP;

Tatuzo Hakuzen, Osaka, JP;

Yasunori Ito, Osaka, JP;

Fusao Takagi, Osaka, JP;

Assignee:

Satosen Co., Ltd., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; C23F / ; B44C / ; C03C / ;
U.S. Cl.
CPC ...
1566591 ; 29852 ; 156656 ; 156666 ; 156902 ; 156280 ; 427 97 ; 427 98 ; 427306 ; 430313 ; 430318 ;
Abstract

This invention provides a process for producing a printed circuit board characterized by the steps of drilling holes in a copper clad laminate, treating the entire surface of the laminate including the hole-defining inner surfaces with a catalyst, removing the catalyst from the surface of the copper foil of the laminate by mechanically cleaning the surface of the copper foil, depositing electroless nickel only on the hole-defining inner surfaces, forming a pattern with an etching resist, etching away the copper foil except at the pattern area, removing the etching resist, masking with a solder resist the entire surface except at the hole-defining inner surfaces and the lands, and subjecting the hole-defining inner surfaces and the lands to electroless copper plating.


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