The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 1985

Filed:

Nov. 18, 1982
Applicant:
Inventors:

Takashi Kanno, Yokohama, JP;

Akira Oka, Tokyo, JP;

Ituo Okamoto, Kawasaki, JP;

Kouji Mizushima, Machida, JP;

Shinji Oguro, Yokohama, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361413 ; 3241 / ; 361394 ; 361395 ; 361415 ;
Abstract

A housing device for housing communication circuits and equipment which includes a frame which can receive a plurality of printed boards, each printed board comprising a communication circuit and circuit cables disposed along the frame. A test jack testing the circuit is disposed at the front end of each printed board, and a connector, which is connected to a connector mounted on the frame, disposed at the rear end of the printed board. The test jack includes further includes first and second leads within a molded body, the opening of each jack being disposed at the front side of the printed board so that the insertion direction is parallel with the printed board. The first and second loads are formed so that they contact each other in the neck of the jack, separate from each other at the rear side of the jack, and project out of said molded body. The first lead of the test jack is connected to a circuit formed on the printed board by a pattern printed thereon and the second lead of the test jack is directly connected to one of the circuit cables.


Find Patent Forward Citations

Loading…