The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1985
Filed:
Oct. 06, 1982
Ikuo Hoshi, Shimodate, JP;
Masami Arai, Shimodate, JP;
Kiyoshi Yokochi, Tochigi, JP;
Yasuo Miyadera, Shimodate, JP;
Atsushi Fujioka, Shimodate, JP;
Takehisa Nakagawa, Yuki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
Copper-clad laminates for printed wiring boards with almost no warpage can be produced continuously without using a solvent by continuously running a continuous, fibrous substrate, supplying partially and intermittently a solventless thermosetting resin mixture to the running substrate, laminating a copper foil at least one surface of the running substrate, pressure molding with heating the copper foil laminated substrate in a mold comprising a pair of flat plates at least one of which has projecting portions tapered to the center of the flat plate at the periphery thereof, taking off and cutting the molded laminate.