The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 1985

Filed:

Nov. 04, 1983
Applicant:
Inventors:

Akira Takenaka, Nagoya, JP;

Keiichi Shimasaki, Nagoya, JP;

Yasumitsu Kuwazuru, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C / ;
U.S. Cl.
CPC ...
308 / ; 384279 ; 384902 ; 384907 ; 2914 / ;
Abstract

The present invention relates to a sliding member having a novel micropore structure and an improved seizure resistance and seal property. Conventionally, the surface roughness of a sliding member is defined by, for example, maximum and/or average roughness. In the present invention, first, there is prepared a sliding member which has a hardness of at least HRc 50 and has micropores for determining the surface roughness of the sliding surface thereof, wherein the micropores, when measured with a particle counter, are present essentially in an amount ranging from 5% to 40% based on an area of the sliding surface and ranging from 2,000 to 150,000 per mm.sup.2 on the sliding surface and have a diameter of at least 0.5 .mu.m. A top portion of ridges which define the micropores is slightly rounded, thereby providing flat or round configuration in terms of the relative load curve, the relative load curve being defined by the accumulative percentage (t.sub.k) and the cutting depth (CV.sub.k) and the accumulative percentage (t.sub.k) being both: an accumulative percentage (t.sub.k) of 5% or less at a cutting depth (CV.sub.k) of less than 1 .mu.m and an accumulative percentage (t.sub.k) of more than 5% but less than 40% at a cutting depth of less than 0.5 .mu.m.


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