The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 1985
Filed:
Sep. 28, 1982
Kazuhisa Ishibashi, Tokyo, JP;
Hideo Kurashima, Yokosuka, JP;
Hisakazu Yasumuro, Yokohama, JP;
Michio Watanabe, Yokohama, JP;
Tsuneo Imatani, Yokosuka, JP;
Kazuo Taira, Tokyo, JP;
Seishichi Kobayashi, Yokohama, JP;
Hiroshi Ueno, Yokosuka, JP;
Toyo Seikan Kaisha, Ltd., Tokyo, JP;
Abstract
Disclosed is a process for preparation of metal vessels, which comprises lap-bonding circumferential open end portions of outer and inner members, each consisting of a formed seamless metal cup, to each other through an adhesive, said process being characterized by fitting both the outer and inner members to each other through an adhesive layer interposed between the open end portions of both the members, heating the fitted portions of both the outer and inner members so as to melt the adhesive layer, and cooling the fitted portions so that the temperatures of the fitted portions of both the outer and inner members are substantially equal to each other just before solidification of the adhesive layer and the adhesive is filled between both the open end portions.