The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 1985

Filed:

Jul. 31, 1980
Applicant:
Inventors:

James A Rinde, Fremont, CA (US);

Eugene F Lopez, Sunnyvale, CA (US);

Leon C Glover, Los Altos, CA (US);

Assignee:

Raychem Corporation, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16L / ;
U.S. Cl.
CPC ...
428 36 ; 428418 ; 174D / ; 138143 ; 138110 ;
Abstract

Novel curable adhesives are solid, substantially free of cross-linking and substantially tack-free at 25.degree. C.; remain substantially uncured when maintained for extended periods at 80.degree. C.; have an initial viscosity of 10.sup.3 to 10.sup.4 poise at 150.degree. C. and cure relatively slowly at 150.degree. C.; and cure rapidly at 200.degree. C. The adhesives preferably contain at least one epoxy resin, particularly an epoxy resin having a softening point of at least 50.degree. C. and an epoxy equivalent weight of at least 200 in combination with an epoxy resin which is liquid at 25.degree. C. or an elastomer or other compatible high molecular weight polymer. The adhesive preferably also contains a high temperature curing agent and preferably also a filler, which may be particulate or fibrous. The novel adhesives are particularly useful in combination with heat-recoverable devices, e.g. devices comprising components made of heat-recoverable metal.


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