The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 1985
Filed:
Mar. 18, 1982
Ananda H Kumar, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of coating or cladding existing metallurgical features of a dielectric substrate by sequentially blanket coating the substrate, inclusive of the metal features, with discrete levels of diverse metals forming alloy systems exhibiting a minimum in the liquidus curve, followed by heating the substrate to a temperature (T.sub.H) at or slightly above the lowest liquidus temperature in the phase diagram of the alloy system and below the melting points of the metal components. During heating to temperature, the metals interdiffuse forming a range of compositions changing with time to form liquid alloys which moves to the substrate surface where it wets and bonds to the metallic features while dewetting the bar substrate surface portions. On cooling the non-adhering portions the alloy can be suitably removed from the substrate surface, as by ultrasonic action, leaving an alloy of the metals strongly bonded only to the pre-existing metallurgical features.