The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 1985
Filed:
May. 16, 1984
John S Rizzo, Birdsboro, PA (US);
AT&T Technologies, Inc., New York, NY (US);
Abstract
An article such as a semiconductor wafer (12) is contacted for plating on an active surface (16). Disposed adjacent to and around the surface (16), there is a conductor such as an annular ring (58) which is adapted for connection to a current source. A composite member (62) has an outer portion (64) for contacting the conductor ring (58) and an inner portion (63) for contacting peripheral regions of surface (16) of the wafer (12). Each of the portions (64 and 63) have a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends. The first ends of the elements in the outer portion (64) are for contacting the conductor (58) and the first ends of the elements in the inner portion are for contacting the surface (16). A coupling member such as a compliant metal foil (66) is contacted to and interconnects the second ends of the elements in the inner and outer portions (63 and 64). Conductive paths are completed from conductor (58) to the surface (16) and the matrix material is compressible to seal the periphery of the wafer (12) to contain ensuing plating to the surface (16).