The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 1985

Filed:

Apr. 27, 1982
Applicant:
Inventors:

Tokio Okada, Tokyo, JP;

Haruhisa Tani, Tokyo, JP;

Shigezo Kojima, Tokyo, JP;

Setsuya Tsuyama, Tokyo, JP;

Kazuhiko Kurihara, Tokyo, JP;

Hiroshi Yazawa, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01D / ; D02J / ;
U.S. Cl.
CPC ...
28282 ;
Abstract

A process for broadening the width of a bundle of parallel filaments having a band form is provided, which comprises, during the running course of the bundle in the lengthwise direction, holding the bundle under press by a direction-turning bar or bars arranged obliquely to the advancing direction of the bundle along its surface; while preventing the bundle approaching the resulting oblique holding line from varying in its approach angle and also shifting to its widthwise direction, turning the direction of the bundle leaving the bar or bars to a direction having an optional angle against the oblique holding line; and taking up the resulting bundle having a required width.


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