The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 1985

Filed:

Aug. 03, 1981
Applicant:
Inventor:

Lewis D Lipschutz, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F / ;
U.S. Cl.
CPC ...
165185 ; 165 / ; 165 / ; 357 82 ; 361386 ;
Abstract

A flexible, extensible thermal conduction element for use in a semiconductor package to conduct heat from a device to a cold plate, or cover, featuring a plurality of thin flexible interleaved leaf elements capable of bridging the gap between the device and cold plate, or cover, and accommodating for gap variability and non-parallel surfaces.


Find Patent Forward Citations

Lipschutz, Lewis. (1985). Flexible thermal conduction element for cooling semiconductor devices (U.S. Patent No. 4498530). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4498530

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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