The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 1985
Filed:
Aug. 05, 1983
Richard K Beltz, Hamburg, PA (US);
Donald M Large, Temple, PA (US);
AT&T Technologies, Inc., New York, NY (US);
Abstract
An article such as a semiconductor wafer (10) is cut by splitting along a line (22) in a plane known to facilitate splitting. Wafer (10) is supported in a laterally unrestrained manner in a holder (34) lined with preferred paper (26) and fitted with a reference plate (43). Paper liner (26) is of a type having a surface (25) capable of developing lateral restraint by friction between such surface (25) and a surface (13) of wafer (10). A resilient force is applied normal to and upon a top surface (11) of wafer (10) by a press (60) having members (75 and 76) applied along line (22). Separation stresses develop along line (22) of the splitting plane and friction forces develop along paper surface (25) providing lateral resistance to an expected cutting force. A cutter (80) has an elongate tool (92) which is advanced at a top edge (27) of wafer (10) where it abuts plate (43). Tool (92) has a leading edge (94) for cutting and lateral faces (95 and 96) converging angularly toward edge (94) for separating cut surfaces. Tool (92) is advanced into and along the splitting plane at a preferred angle of about forty-five degrees between wafer surface (11) and elongate portion (93) of tool (92). Utilizing a micrometer assisted assembly (86), a gradual, calibrated force is applied to advance tool (92) for a precise distance into wafer (10). Tool (92) provides sufficient cutting and separation that a split becomes self-propagating along line (22) through wafer (10).