The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 1985
Filed:
Feb. 16, 1983
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
A method and apparatus for automatically changing a plating thickness in an electrical plating line in which unwanted over-plating is prevented. The plating line includes a plurality of plating tanks through which a member to be plated is conveyed and corresponding plating current sources. As a plating thickness change point on the member to be plated passes through the various tanks, a first plating current corresponding to a first plating thickness is applied through plating current power sources before the plating thickness change point, while a second plating current corresponding to a second plating thickness is applied through plating current power sources of tanks after the plating thickness change point. To prevent arcing as the plating thickness change point passes through the apparatus, plating current application is suspended in the two tanks on either side of the plating thickness change point.