The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 1985
Filed:
Mar. 11, 1982
Applicant:
Inventors:
Kenzo Hatada, Katano, JP;
Isamu Kitahiro, Yawata, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
2281 / ; 228188 ;
Abstract
A method suitable for connecting a plurality of metal leads at the same time with electrodes of a semiconductor device. Metal leads are provided each of which has a metal bump bonded thereto. The metal of the metal bump is softer than that of the lead. Those metal leads are located above the semiconductor device so that the bumps are contacted with the electrodes and then the bumps are bonded to the electrodes by heating, whereby the metal leads are connected with the electrodes.
Hatada, Kenzo. (1985). Method of connecting metal leads with electrodes of semiconductor device (U.S. Patent No. 4494688). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4494688
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile