The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 1985
Filed:
Mar. 08, 1983
Applicant:
Inventors:
Tamotsu Ueyama, Katsuta, JP;
Takao Yamada, Katsuta, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
252514 ; 252512 ; 252518 ; 252521 ; 524430 ; 524433 ; 524439 ;
Abstract
A highly electroconductive paste for metallizing comprising (a) a high-melting metal powder such as W, Mo, Mo-Mn, Pt, etc., powder, (b) an additive such as MgO, CaO, SiO.sub.2, Al.sub.2 O.sub.3, etc., in an amount of 0.1 to 3 parts by weight per 100 parts by weight of the metal powder, (c) a binding agent, and (d) a solvent can give a highly electroconductive metallized ceramic having strongly bonded metallized layer by coating said paste on an alumina ceramic substrate and firing it.