The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 1985

Filed:

Jul. 28, 1982
Applicant:
Inventors:

Alex M Brzezinski, Indianapolis, IN (US);

Harold J Hershey, Indianapolis, IN (US);

Stephen R Whitesell, Indianapolis, IN (US);

Assignee:

AT&T Bell Laboratories, Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R / ; H04R / ; H04R / ;
U.S. Cl.
CPC ...
1791 / ; 29 2535 ; 310324 ;
Abstract

A transducer embodying the present invention is assembled on a discrete electrically conductive frame (100) that has been formed to provide both leads (120-140) and a backplate (110). An integrated circuit chip (200) is bonded to one of the leads, and a dielectric inner housing member (300) is molded about the backplate and the portion of the leads adjacent to it. The inner housing member encapsulates the chip, embraces the perimeter of the backplate, and provides a cylindrical opening (310) that extends on each side of the backplate. A conductive outer housing member (400) is subsequently molded about the perimeter of the inner housing member, and a spacer (500), electret diaphragm assembly (600), and conductive gasket (700) are sequentially positioned in the opening on one side of the backplate. Conductive front and back covers (800,900) are thereafter bonded to the outer housing to close the opening and to complete a conductive enclosure that provides electrostatic shielding for the transducer. In addition, electrical continuity is provided between a metalized surface on the electret diaphragm and the conductive enclosure by means of the gasket.


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